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VITA 42.3
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2026
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XMC PCI Express Protocol Layer Standard - This standard defines the implementation of PCI Express on VITA 42.0, XMC.
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VITA 48.1
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2026
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This standard defines the mechanical requirements that are needed to insure the mechanical interchangeability of air cooled 3U and 6U Plug-In Modules and define the features required to achieve Two Level Maintenance compatibility.
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VITA 48.5
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2026
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Establishes the design requirements for an air-flow-through cooled plug-in unit with a form factor as close to 6U as possible while retaining the VITA 46 connector layout. Unlike ANSI/VITA 48.1, which uses cooling air impinged directly upon the components
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VITA 57.1
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2026
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FPGA Mezzanine Card (FMC) Standard - This standard defines the mechanical format and signal assignments for an FPGA mezzanine card interface.
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VITA 57.4
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2026
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This standard extends the VITA 57.1 FMC standard by specifying two new connectors that enable additional Gigabit Transceiver interfaces that run at up to 28Gbps. It also describes FMC+ IO modules which support this enhanced version of the FMC electro-mech
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VITA 62.2
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2026
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This standard provides requirements for building a 270 volt/3U or 6U class power supply module that can be used to power a VPX chassis in the VITA 62 family of standards in high altitude applications.
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VITA 67.2
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2026
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Coaxial Interconnect on VPX, 8 Position SMPM Configuration - The objective of this standard is to detail the configuration and interconnect within the structure of VITA 67.0 enabling a VITA 46 interface containing multi-position blind mate analog connecto
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